[1] F Coeuret. J. Appl. Electrochem., 1980(10): 687~696.
[2] 草壁克己等. 工业用水, 1983(298): 25~33.
[3] 覃奇贤等. 电镀与环保, 1990, 14(2): 2 3~25.
[4] Evans J W. Proc.-Electrochem., 1988(18): 504~507.
[5] . K Rajeshwar eTal. J. Appl. Electrochem., 194(24): 1077~1091.
[6] . BickhursTJ R eTal. J. Electrochem. Soc., 1969, 1 16, 1600.
[7] . S P Ho eTal. Wat. Res. 1990, 24(11): 1317~1 3 2 1.
[8] . 张红波等. 化工环保, 1983, 3(6): 358~361.
[9] . 张红波等. 电镀与环保, 1992, 1 2(6): 20~2 3.
[10] . 朱宏丽等. 环境科学, 1985, 6(6): 36~40.
[11] Do Jingshan eTal. J. Electrochem. Soc., 1993, 140(6): 163 2~1637.
[12] FleeTBernard eTal. Chem. Commun., 1988(53): 1 108~1 1 3 3.
[13] V D Stankovic eTal. Appl. Electrochem., 1991(21): 1 24~129.
[14] . Van der Heiden eTal. J. Electrochem. Soc., 1978(130): 465.
[15] . Carlsson L eTal. J. Electrochem. Soc., 1983(130): 342.
[16] . K Scott. J. Appl. Electrochem., 1981(11): 3 39~346.
[17] . V D Stankovic eTal. ibid, 1984(14): 615~621.
[18] . K Sccot. ibid, 1988(18): 604~510.
[19] . V D Stankovic eTal. ibid, 1991(21): 1 24~1 29.
[20] . R P Tison eTal. Plate & Sur Fin 1984(9): 54~56.
[21] Kenedy I F, TDas Gupta. S: FirsTAnnual Conf., on Advanced Pollution Control for the Metal Finishing Ind..
[22] G Kresa eTal. J. Appl. Electrochem., 1982(12): 241~251.
[23] Kreysa G. Chem. Ing. Tech., 1970(50): 3 3 2.
[24] . French 2 3 1 1760.
[25] . French 2 2 15399.
[26] . U. S 3725226.
[27] . F CoeureTeTal. J. Appl. Electrochem., 1988(18): 162~165.
[28] . C L K Tennakoon eTal. J. Appl. Electrochem., 1996(26): 18 ~1929 JP81 105792.
[30] . JP 602~2786.
[31] M eissner Wolfgang eTal. Chem. Ind., 1991, 1 14(10): 20, 2 2, 24.
[32] 汪群慧. 南京化工学院学报, 1991, 1 3(3): 59~62
[33] JP 0416286.
[34] . JP0671268.
[35] . JP0686982.
[36] . JP 0686981.
[37] . JP 6014987.
[38] . Zhou Ding eTal. Wat. Sco. Tech., 1987(19): 391~400.
[39] . 周抗寒等. 环境科学, 1994, 15(2): 38~40.
[40] . U S 46[19745.
[41] 张一先等. 北京师范大学学报, 1984(2): 45~53.
[42] G Kreysa eTal. J. Appl. Electrochem., 1982(12): 241~242.
[43] K Kusakabe eTal. J. Chem. Eng. Jpn., 198
[2] (15): 45~50.
[44] . G Kreysa eTal. DECHEMA Monogr., 1983(93): 177~192.
[45] . 姚庆一等. 工程学刊, 1990(50): 39~56.
[46] Kishi Tomiya eTal. Denki Kagaku, 1982, 50(2): 178~183.
47 Kishi Tomiya. Denki Kagaku, 1985, 53(1): 69~74.
[48] Hun TeTal. J. Electrochem. Soc., 1989, 1 34(2): 308~321.
[49] 阎桂番等. 西北大学学报, 1986, 16(2): 3 3~36.
[50] Lee J K eTal. J. Appl. Electrochem., 1989(19): 877~881.
[51] U mnov A B eTal. Zh. Prikl. Khim., 1990(19): 877~881.
[52] 安田守宏, 古内哲哉. Denki Kagaku, 1993, 61(4): 431~43] 4.
[53] Yang Bo eTal. Proc.-Electrochem. Soc., 1987(88~21): 487 ~497.
[54] Taspakh S L eTal. Electrokhimiya, 1990, 2] 6(7): 914.
[55] Valantin Gerard eTal. J. Chim. Phys. Phys-Chim. Biol., 1988, 85(2): 281~292.
[56] Y P Sun eTal. J. Appl. Electrochem., 1995(25): 65~82,
[57] Millinger C G eTal. Inst. Chem. Eng. Symp. Ser., 1989 (112): 1 29~140.
[58] Beigmann H eTal. DECHEMA-Monogr., 1992(125): 65~82.
[59] Kreysa G eTal. J. Appl. Electrochem., 1993(23): 707~710.
[60] 庞文亮等. 电镀与环保, 1989, 9(6): 18~2 2.
[61] 胡春等. 环境科学进展, 1995, 3(1): 55~62.
[62] 刘岩. 环境科学进展, 1995, 3(4): 76~79.
[63] 张维新等. 环境工程, 1995, 13(5): 7~9 |